Buy AMD EPYC 7453 24-Core Server CPU 2.75GHz SP3 Socket 225W TDP High-Frequency Milan Processor

AMD EPYC™ 7453 Processor - Full Specifications

Core Architecture & Configuration

• Model: AMD EPYC™ 7453

• Series: EPYC™ 7003 Series ("Milan")

• Core Architecture: AMD "Zen 3"

• Manufacturing Process: 7 nm FinFET

• Number of Cores: 24

• Number of Threads: 48

• Base Clock: 2.75 GHz

• Maximum Boost Clock: Up to 3.45 GHz (CPU Core Frequency)

• Default TDP / TDP: 225 W

• cTDP: Configurable TDP down: 200 W | Configurable TDP up: 240 W

• Total L3 Cache: 64 MB (Unified, shared across all cores in a CCD)

• Total L2 Cache: 12 MB (512 KB per core)

Platform & Interface

• Socket: SP3 (Socket P3) - Compatible with platforms supporting AMD EPYC 7002 (Rome) and 7003 (Milan) series processors.

•  A BIOS update is required for Rome platforms.

• PCI Express® Version: PCIe 4.0

• Number of PCIe Lanes: 128 Lanes

• Security: AMD Infinity Guard

• AMD Secure Memory Encryption (SME)

• AMD Secure Encrypted Virtualization (SEV) | SEV-Encrypted State (SEV-ES) | SEV-Secure Nested Paging (SEV-SNP)

Memory Support

• Memory Type: DDR4

• Memory Channels: 8-Channel

• Maximum Memory Speed: Up to 3200 MHz

• ECC Support: Yes, ECC (Error-Correcting Code) memory supported

• Maximum Memory Capacity: 4 TB per socket (with LRDIMMs)

Advanced Features & Technologies

• Supported Technologies:

• AMD Infinity Architecture

• AMD Secure Processor

• AMD Memory Guard

• AMD Virtualization™ (AMD-V™) technology with IOMMU

• AMD-V Extended Migration

• AMD PowerNow!™ technology

• Advanced Platform Management Link (APML)

• Instruction Set Extensions: AMD64, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, AVX2, AVX-512 (BFLOAT16, VNNI), FMA3, AES, CLMUL

Performance & Power

• Launch Date: Q1 2021

• Part Number: 100-000000215

• Thermal Solution: A high-performance heatsink and active cooling solution rated for 225W TDP (or higher) is required.

Key Positioning Summary
The AMD EPYC 7453 is a high-frequency profile processor within the Milan lineup. It is engineered for workloads that benefit from a strong balance of:

1. High per-core performance from its elevated base clock and Zen 3 IPC gains.

2. Substantial multi-threading capability with 24 cores/48 threads.

3. Large, low-latency cache thanks to the unified 64MB L3 design of Zen 3.

It is ideally suited for High-Performance Computing (HPC), enterprise virtu